World-Leading Semiconductor Probe Card & Advanced Test Product Manufacturing Facility in Baldwin Park, CA

World-Leading Semiconductor Probe Card & Advanced Test Product Manufacturing Facility in Baldwin Park, CA (#62) 05/26/2026 10:00 AM PDT Closed
Starts Ending 05/26/2026 10:00 AM PDT

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Description
🚨Former Assets of a World-Leading Semiconductor Probe Card & Advanced Test Product Manufacturing Facility 🚨

Late-Model LTCC, Photolithography, Electroplating, Precision Lapping, Laser Processing, Wafer Probe Test & Class-Rated Cleanroom Equipment

🌟 Sale Highlights

BidItUp is proud to present a major liquidation auction featuring the complete equipment package from one of the world's premier facilities for semiconductor probe card and advanced wafer-test product manufacturing in Baldwin Park, California. This world-class operation produced high-precision test products used to qualify and production-test the integrated circuits powering today's smartphones, tablets, automotive electronics, computing platforms, AI accelerators, and consumer devices.

The facility was outfitted with a complete, vertically integrated process flow — combining LTCC ceramic substrate fabrication, MEMS-style spring-probe processing, wafer-level photolithography, electroplating, laser micromachining, precision lapping & polishing, and full-coverage automated test and metrology — all under one roof in a Class-rated cleanroom environment.

A significant portion of the assets were purchased between 2021 and 2025, with multi-million-dollar capital investments in late-model lithography, lamination, plating, and laser processing tools.

This is a rare opportunity to acquire production-ready, low-hour tooling from a tier-one probe card / test product manufacturer at a fraction of replacement cost — ideal for probe card makers, semiconductor test houses, MEMS foundries, RF / microwave module manufacturers, universities, national labs, and contract manufacturers looking to scale fast.

🏭 Major Asset Categories

🧱 LTCC / Ceramic Substrate Production:
- Quintus Technologies IL22247.5 Isostatic LTCC Laminator (2.0) — 2023, 480V 3-phase
- Microtec MT-650TVC LTCC screen printer with vision alignment
- Elmas screen printer & large-format screen printer
- Shenzhen ZYE ZYE21515 / ZYE21525 three-roll mills for LTCC ink manufacturing
- L&L EL2424-H industrial front-loading kilns (six) — 22"×22"×44", 480V 3-phase, 2350°F
- Hengli HSF5005-0503Z 5-zone belt drying furnace, wire-mesh conveyor
- CoorsTek alumina setters for ceramic firing
- LTCC frame racks (multiple), green-ceramic machining tooling
- Punching machines (multiple) for green-tape / flex substrate punching
- Vacuum sealer & process tooling for LTCC tape handling
- Dynachem VA 7224 HP7 vacuum laminator with film release kit (2021)
🔬 Photolithography & Wafer-Level Processing:
- Microtech LaserWriter LW405-D maskless lithography systems (2022)
- Tamarack Scientific Model 302 & 303 large-area scanning projection lithography systems
- CEE / Cost Effective Equipment Apogee 450 XPro auto develop & strip systems (multiple)
- CEE Apogee Spin Coaters / Resist Coaters (multiple, including 200FX upgrade)
- CEE PSPI / Resist Coater systems
- Apogee custom large-format bake plate with integrated water chiller
- Apogee dual hot plate stations
- Trion RIE Plasma Etching System & PlasmaEtch BT-1-RIE
- Sputtertech 4451 sputter deposition system
- Sitek / Semitool 4400 spin rinse dryers (multiple, w/ custom SRD fixtures)
- Spray developer & dedicated photoresist (KMPR) processing tools
- Photomask cleaner
- Cascade Tek TVO-5-A vacuum bake-out oven
- Multiple MTS hot plates & dedicated semiconductor process plates
⚛️ Metrology, Inspection & Analysis:
- FRT MicroProf 300 automated wafer thickness / 3D surface metrology system (2024)
- Cyber Technologies CT-350 non-contact surface profilometer with upgraded L-CHR line sensor (2025) and dual chromatic confocal sensor platform
- Filmetrics Profilm 200 3D metrology tool
- Confocal Interferometer
- Sigmatech Measuring System & Z-Scope wafer inspection stations (300mm)
- Orbotech UD800 Ultra Dimension AOI System (2022)
- ASC VisionPro Merlin AOI (2022)
- Shimadzu UV-Vis Spectrophotometer
- Atomic Absorption Spectrometer
- Nikon SMZ800 stereo microscope, Nikon Optiphot 300 inspection microscope
- 9600m² 300mm manual thickness measurement station
- Particles Plus 8506-30 cleanroom particle counters
- Keysight 86100C oscilloscope mainframe with sampling modules
🔌 Wafer Probe & Device Test:
- Accretech UF3000EX wafer probers (multiple) with extender and lift-assist tooling
- V5400 Test Head with Hifix interface
- V6000e test platforms (multiple)
- EVA 100 PC tester
- MicroCraft EMMA E4H6151 flying probe testers (multiple, 2022) with capacitance measurement upgrades
- MicroCraft IGI PT & EXT software platforms
- Auto Probe Adjustment Tool (Viteris VSPR02) software upgrade
- LaPlace CAN300 software platforms
- Tunable laser for device characterization
⚡ Electroplating & Wet Process:
- Extensive in-house plating bench — 14+ custom plating tanks, dip tanks, and etch tanks
- Custom Au (gold) plating tanks with paddle agitation (Wafab)
- Semi-automated copper plating bench
- Amerimade plating bench computers / process controllers
- Kinetics hot N₂ dryer with cascade rinse for plating area
- Golden Fab paddle tank systems
- Nickel tank lid sensors (Jsat custom)
- Replacement HEPA filters, dump rinse units, custom wet benches & release benches
- Arbin Instruments electroplating power supplies (multiple channels including NiMn-deflector configuration)
🛠️ Precision Lapping, Polishing & Machining:
- Engis 36" FastLap System (2022) — 36" plate, 230V 3-phase
- Engis EVG-300 lapping/grinding system, touchscreen, 2019
- Engis 28" Hyprez machines (with and without powered roller drivers / yokes)
- Engis Hyprez ultra-precision lapping system (EAR-controlled)
- Haas VF-2 CNC Vertical Machining Center (2022) with camera alignment
- Ceramic / green-ceramic machining tooling (multiple stations)
- Flat-bed laser marking system
💡 Laser Processing:
- ESI Geode automated UV laser processing system with autoloader
- ESI 5335 laser drilling systems (multiple, including a 2025 unit)
- Quantum Composers LS635B-S2 laser system with spare RDL repair laser head
- Laser Clean #1 & #2 systems
- Lasersell LSR-0500 heat block stage with software control upgrade (2025)
- UV laser & UV cure system (Semiconductor Equipment Corp.)
- Bungard EXP3040LED LED blanket exposure unit
🌬️ Cleanroom & Facility Infrastructure:
- B2-2H Class-rated cleanroom buildout — leasehold improvements & integrated machinery package
- Bay 4 Cleanroom & Building #2 Cleanroom Conversion
- Servico custom air shower purpose-built for MEMS-grade fab operation
- RDL cleanroom expansion — HEPA filter & panel install
- Cleanroom monitoring system, Nortec humidifier, Johnson Controls integration, supplemental heater
- Gilmore 3,000-gallon liquid nitrogen system
- 7.5-ton package air conditioner, plant evaporative cooler, heat-pump mini-split systems
- Plant electrical distribution & custom exhaust systems
🧪 Additional Process, Assembly & Support Equipment:
- S-Cubed RDL Polisher & Scrub Cleaner System (Model 7-02112-000, 2025)
- Thinky ARE-501 planetary centrifugal mixer
- Thinky SR-500 solder paste mixer
- Kolb PSE 300 2VL automatic dual-tank screen / PCB cleaning system (2023)
- Atco reflow oven & conveyor reflow oven
- S10 CIP Mounter (chip mounter)
- Nordson D-595 DispenseMate 525mm fluid dispenser
- Orion 200i3 precision welder
- TECA AHP-2700CPV RDL cool plates
- Thermo Fisher 170L brim-attach bake oven
- Thermo Scientific TSG505SA lab freezer (RDL lamination material storage)
- Brookfield Ametek DVNXB3CBG cone/plate viscometer (2023)
- Dielectric curing oven, vacuum ovens, convection ovens
- Multiple hot plates, chill plates, and process benches
- Manufacturing fixtures, substrate-handling tooling & custom jigs
🖥️ IT, Network & Facility Electronics:
- HPE ProLiant DL380 Gen10 servers
- Synology SA3400D (300TB) storage system
- Juniper EX-4300 switches
- Aruba 515 wireless access points
- Cisco Catalyst 9300 & 3750 switches
- Falcon UPS & rack-mounted UPS systems
- Door access control / HID badge readers
- UKG InTouch DX time clocks
💼 Ideal For:
- Semiconductor Probe Card Manufacturers
- Semiconductor Test & ATE Equipment Companies
- MEMS Foundries & MEMS Device Producers
- LTCC & High-Reliability Ceramic Substrate Manufacturers
- RF, Microwave & Sensor Module Manufacturers
- Thin-Film & Microelectronic Packaging Operations
- Aerospace, Defense & High-Reliability Electronics Suppliers
- Universities, National Labs & Research Institutions
- Contract Manufacturers, Job Shops & Prototype Houses
- Hardware Startups Scaling from R&D to Production
- Electroplating & Surface-Finish Job Shops
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Terms and conditions
BidItUp, LLC
Bidder’s Binding Contract

Definitions
- Agreement: This document is the BidItUp, LLC Bidder’s Binding Contract and governs all terms of participation in the auction.
- Auctioneer: BidItUp, LLC, acting as the auctioneer, seller, or legal owner of LOTS during the auction process.
- Bidder: The individual or entity (e.g., sole proprietor, partnership, corporation, trustee, agent, etc.) who places a bid is electronically agreeing to these terms and conditions and is authorized by the Auctioneer to participate in bidding.
- Buyer’s Premium: A percentage added to the winning bid price. For example, with a 20% Buyer’s Premium, a $100 bid results in an invoice total of $120, plus applicable sales tax.
- Lots: Any items offered for bidding by the Auctioneer.
- Owner: The legal owner of any item offered as part of a Lot.
Bidder Responsibilities Regarding Bids
- All bids placed are final, binding, and cannot be rescinded or altered under any circumstances.
- By placing a bid, the Bidder affirms that they have fully reviewed the terms of the auction and accept that every bid represents a binding contractual obligation.
- The Auctioneer will not accept claims of accidental bids or bidding errors; it is the Bidder's sole responsibility to review and confirm their actions prior to submitting a bid.
Key Terms
1. Auction Conduct:
  - This auction will adhere to the terms in this Agreement. Changes, amendments, or announcements by the Auctioneer may supersede these terms and will be posted on www.biditup.com or announced during the auction.
2. Buyer Beware:
  - All Lots are sold “AS IS, WHERE IS” with no warranties, expressed or implied, regarding condition, fitness for purpose, or merchantability.
  - It is the Bidder’s responsibility to inspect Lots before bidding.
3. Reserve Auction:
  - This auction is conducted with reserve, and the Auctioneer reserves the right to bid on Lots and accept or reject bids at its sole discretion.
4. Description Accuracy:
  - Descriptions, advertisements, and invoices are for informational purposes only and may change without notice.
  - Bidder agrees to rely solely on their inspection and investigation of Lots and not on Auctioneer-provided descriptions.
Buyer Default Clause
- In the event of default by the Bidder, including failure to make payment or remove Lots within the specified timeframe, the Auctioneer reserves the right to resell the Lots or dispose of them at the Bidder’s expense. The Bidder shall be responsible for all associated costs, including but not limited to storage fees, disposal fees, and legal expenses.
No Refunds or Returns
- There are no refunds, returns, or exchanges of any kind. All sales are final.
Responsibilities and Liabilities
- Inspection: Bidders are encouraged to inspect Lots before bidding. Failure to inspect does not constitute grounds for cancellation or refunds.
- Binding Contract: A successful bid creates a legally binding contract, and the Bidder is responsible for payment and removal of Lots as detailed in this Agreement.
- Risk of Loss: Once the Auctioneer announces a sale, the Bidder assumes all risks, including theft, loss, or damage. Insurance coverage is recommended.
- Non-Payment Penalties: Failure to pay invoices in full within 24 hours may result in:
  1. Forfeiture of deposits.
  2. Resale or disposal of Lots at the Bidder’s expense.
  3. Additional fees, including a $500 administrative fee per day and legal fees.
Non-Negotiable Auctioneer Fees
- All fees, including but not limited to the Buyer’s Premium, title transfer fees, and administrative charges, are non-negotiable and must be paid in full as part of the total invoice.
Processes

1. Payment
- All fees, including the Buyer’s Premium and title transfer fees, are final and must be paid in full.
1. Payment
- A 25% deposit is required via cash, cashier’s check, or wire transfer. Credit cards are not accepted.
- Final payments must be received within 24 hours after the auction.
- Tax exemptions must be documented with valid proof. Otherwise, sales tax will apply.
2. Removal of Lots
- Lots must be removed by the deadline stated on the invoice.
- Any Lots not removed within the stated timeframe will be considered abandoned and may be resold, disposed of, or otherwise managed at the Bidder’s expense.
- Bidder is responsible for:
  - Disconnecting all machinery or equipment at the first available junction or connection point.
  - Providing proof of insurance (worker’s compensation and liability).
  - Disconnecting utilities and ensuring safe removal.
  - Cleaning the area (e.g., floor bolts cut flush and debris removed).
3. Hazardous Materials and Safety
- Certain Lots may contain residual chemicals, oils, or hazardous materials. The Bidder is solely responsible for the safe handling, removal, and disposal of such materials in compliance with all applicable federal, state, and local environmental laws.
- Any spills, leaks, or contamination resulting from the removal process must be immediately addressed by the Bidder at their expense.
4. Tie Bids and Discretionary Awards
- In the event of a tie bid, the Auctioneer will determine the winning Bidder at its sole discretion. The Auctioneer’s decision is final and binding.
- The Auctioneer reserves the right to award a Lot to a Bidder's last registered bid at its sole discretion, even in the absence of competitive bids or tie scenarios.
4. Auctioneer Rights
- The Auctioneer may:
  - Adjust bidding increments or group Lots.
  - Cancel, suspend, or reschedule sales.
  - Reject bids at its sole discretion.
6. Online Auction-Specific Terms
- The Auctioneer is not responsible for errors in online bidding, including but not limited to software malfunctions, connectivity issues, or user errors. Bidders assume full responsibility for bids placed online and are encouraged to verify all entries before submission.
5. Recordings
- The Auctioneer reserves the right to create image and audio/video recordings of the auction. By participating, the Bidder consents to the use of these recordings for promotional, operational, or legal purposes.
Additional Terms
- Binding Arbitration:
  - All disputes will be settled by arbitration in Nevada.
  - Each party bears its own arbitration costs unless otherwise awarded.
- No Liability for Malfunctions:
  - The Auctioneer is not liable for errors, delays, or site malfunctions. Sales affected by technical issues may be voided or rescheduled.
- Environmental Compliance:
  - Bidders are fully responsible for ensuring compliance with all environmental laws and proper handling of hazardous materials during removal.
- Withdrawal of Lots:
  - The Auctioneer reserves the right to withdraw any Lot from the auction at its sole discretion, without prior notice or liability.
- Severability:
  - If any clause is deemed unenforceable, the remaining terms remain in effect.
- Time is of the Essence:
  - Deadlines for payment and removal are strictly enforced. Non-compliance results in additional fees and liabilities.
- Force Majeure Clause:
  - The Auctioneer is not liable for delays or failure to perform due to causes beyond its reasonable control, including natural disasters, government actions, or technical failures.
- Waiver of Rights:
  - Bidders waive all rights under any state or federal laws that may limit the enforceability of general releases, including but not limited to Nevada law equivalents of California Civil Code Section 1542.
Agreement on Bidding Platform

By registering to bid for this auction, you are agreeing to these terms and conditions as outlined on the bidding platform.

Marketing Opt-In

By registering for this sale, you are opting in to the advertising mailing list, eblast notifications, and call list for this sale and upcoming offers.

Acknowledgment

By participating in this auction, the Bidder acknowledges and agrees to the terms and conditions outlined in this Agreement. Failure to comply may result in penalties, suspension of bidding privileges, or legal action.

World-Leading Semiconductor Probe Card & Advanced Test Product Manufacturing Facility in Baldwin Park, CA (#62) 05/26/2026 10:00 AM PDT Closed Starts Ending 05/26/2026 10:00 AM PDT

🚨Former Assets of a World-Leading Semiconductor Probe Card & Advanced Test Product Manufacturing Facility 🚨

Late-Model LTCC, Photolithography, Electroplating, Precision Lapping, Laser Processing, Wafer Probe Test & Class-Rated Cleanroom Equipment

🌟 Sale Highlights

🏭 Major Asset Categories

💼 Ideal For:

Definitions

Bidder Responsibilities Regarding Bids

Key Terms

Buyer Default Clause

No Refunds or Returns

Responsibilities and Liabilities

Non-Negotiable Auctioneer Fees

Processes

Additional Terms

Agreement on Bidding Platform

Marketing Opt-In

Acknowledgment

World-Leading Semiconductor Probe Card & Advanced Test Product Manufacturing Facility in Baldwin Park, CA (#62) 05/26/2026 10:00 AM PDT Closed
Starts Ending 05/26/2026 10:00 AM PDT